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QLC NAND

AI Inference
2026-08-15 07:30:00

AI inference is pushing NAND deeper into the memory stack, and Sandisk is betting on it

AI spending in semiconductors has largely been framed around GPUs, high-bandwidth memory, networking and power. This report argues that inference is widening that trade. As AI systems move from training to serving billions of queries, enterprise agents, multimodal workloads and real-time applications, the need to keep large pools of data accessible at reasonable cost is becoming more central. That is giving NAND a larger role as a capacity layer alongside HBM and DRAM, rather than leaving it as a conventional commodity storage product. Sandisk has become one of the clearest public advocates of that view. At its 2026 investor day, the company said enterprise data center flash demand could reach 1.2 ZB by 2030 and projected mid-to-high double-digit annual revenue growth from FY2028 through FY2030, with Reuters cited in the source for related expectations. The company is also developing High Bandwidth Flash, or HBF, for AI inference, while continuing to push denser QLC NAND products. At the same time, Sandisk and other storage makers are leaning more heavily on multi-year customer agreements. Reuters, as cited in the source, reported that Sandisk had signed eight long-term agreements with six customers worth about $93.9 billion in total. The article’s main conclusion is narrower than a permanent re-rating story. AI is unlikely to erase NAND cyclicality. What may change is the amplitude: stronger bit demand, better demand visibility and tighter supply discipline could make future NAND cycles less violent than in the past.

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AI inference is pushing NAND deeper into the memory stack, and Sandisk is betting on it
Kioxia
2026-08-05 00:09:52

Kioxia and Sandisk unveil 332-layer QLC 3D NAND with 4,800 MT/s interface

Kioxia and Sandisk introduced their latest BiCS10 3D QLC NAND flash chip at the Future of Memory and Storage Conference on Aug. 5, describing it as the highest-density 3D NAND product that has been formally launched worldwide. The chip uses a 332-layer stack and reaches a storage density of 37 Gb/mm², with interface speeds of up to 4,800 MT/s and support for Separate Command Address, or SCA. The companies said the product is aimed at high-capacity data center SSDs. Compared with their earlier BiCS10 3D TLC NAND, which delivered storage density above 29 Gb/mm², the new QLC version pushes capacity density higher for data center storage. Industry estimates cited in the report said the chip could reach roughly 1.33 Tb under similar die size and memory cell count assumptions, though the companies have not disclosed an official capacity specification. Kioxia and Sandisk also introduced PI-LTT technology to improve high-speed signal integrity while reducing output driver power consumption. The two companies said the latest BiCS10 process could also help lower manufacturing costs after production ramps up.

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Kioxia and Sandisk unveil 332-layer QLC 3D NAND with 4,800 MT/s interface